Datenblatt-Suchmaschine für elektronische Bauteile |
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TPA3250D2DDWR Datenblatt(PDF) 6 Page - Texas Instruments |
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TPA3250D2DDWR Datenblatt(HTML) 6 Page - Texas Instruments |
6 / 41 page 6 TPA3250 SLASE99A – DECEMBER 2015 – REVISED APRIL 2016 www.ti.com Product Folder Links: TPA3250 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT PVDD_x Half-bridge supply DC supply voltage 12 32 38 V GVDD_x Supply for logic regulators and gate-drive circuitry DC supply voltage 10.8 12 13.2 V VDD Digital regulator supply voltage DC supply voltage 10.8 12 13.2 V RL(BTL) Load impedance Output filter inductance within recommended value range 2.7 4 Ω RL(SE) 1.5 3 RL(PBTL) 1.6 2 LOUT(BTL) Output filter inductance Minimum output inductance at IOC 5 μH LOUT(SE) 5 LOUT(PBTL) 5 FPWM PWM frame rate selectable for AM interference avoidance; 1% Resistor tolerance Nominal 430 450 470 kHz AM1 475 500 525 AM2 575 600 625 R(FREQ_ADJ) PWM frame rate programming resistor Nominal; Master mode 29.7 30 30.3 k Ω AM1; Master mode 19.8 20 20.2 AM2; Master mode 9.9 10 10.1 CPVDD PVDD close decoupling capacitors 1.0 μF ROC Over-current programming resistor Resistor tolerance = 5% 22 30 k Ω ROC(LATCHED) Over-current programming resistor Resistor tolerance = 5% 47 64 k Ω V(FREQ_ADJ) Voltage on FREQ_ADJ pin for slave mode operation Slave mode 3.3 V TJ Junction temperature 0 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPA3250 UNIT DDV 44-PINS HTSSOP JEDEC STANDARD 4 LAYER PCB RθJA Junction-to-ambient thermal resistance 26.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 10.2 °C/W RθJB Junction-to-board thermal resistance 6.5 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 6.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W |
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