DATA SHEET • SMP1325-085LF: SURFACE-MOUNT PIN DIODE

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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March 13, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201648F

Electrical and Mechanical Specifications

The absolute maximum ratings of the SMP1325-085LF are

provided in Table 1. Electrical specifications are provided in

Table 2.

A plot of series resistance versus formard current is shown in

Figure 2.

Table 1. SMP1325-085LF Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

Reverse voltage

200

V

Forward current @ 25

°C

200

mA

CW power dissipation @ 85

°C

4.5

W

Peak pulse power dissipation @ 85 °C (10% duty cycle)

450

W

Storage temperature

–65

+200

C

Operating temperature

–40

+150

C

Note:

Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other

parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.

CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device

must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body

or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.

Table 2. SMP1325-085LF Electrical Specifications (Note 1)

Parameter

Symbol

Test Condition

Min

Typical

Max

Units

Reverse current

10

μA

Capacitance

0.56

0.65

pF

Resistance

f = 100 MHz

8

1.3

0.35

0.50

Ω

Ω

Ω

Forward voltage

0.65

V

Carrier lifetime

5

μs

I region width

W

100

μm

CW thermal resistance (Note 2)

13

C/W

Note 1: Performance is guaranteed only under the conditions listed in this table.

Note 2: Measurement based on a thermal resistance of 92

C/W for the junction-to-bottom of circuit board.