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ADC08500 Datenblatt(PDF) 8 Page - Texas Instruments |
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ADC08500 Datenblatt(HTML) 8 Page - Texas Instruments |
8 / 46 page ADC08500 SNAS373E – MAY 2007 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA, VDR) 2.2V Supply Difference VDR - VA 0V to 100 mV Voltage on Any Input Pin (Except VIN+, VIN- ) −0.15V to (VA +0.15V) Voltage on VIN+, VIN- (Maintaining Common Mode) -0.15V to 2.5V Ground Difference |GND - DR GND| 0V to 100 mV Input Current at Any Pin (4) ±25 mA Package Input Current (4) ±50 mA Power Dissipation at TA = 85°C 2.0 W ESD Susceptibility (5) Human Body Model 2500V Machine Model 250V Storage Temperature −65°C to +150°C (1) All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified. (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. This limit is not placed upon the power, ground and digital output pins. (5) Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through ZERO Ohms. Operating Ratings (1) (2) Ambient Temperature Range −40°C ≤ TA ≤ +85°C Supply Voltage (VA) +1.8V to +2.0V Driver Supply Voltage (VDR) +1.8V to VA Analog Input Common Mode Voltage VCMO ±50 mV VIN+, VIN- Voltage Range (Maintaining Common Mode) 0V to 2.15V (100% duty cycle) 0V to 2.5V (10% duty cycle) Ground Difference (|GND - DR GND|) 0V CLK Pins Voltage Range 0V to VA Differential CLK Amplitude 0.4VP-P to 2.0VP-P (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified. Package Thermal Resistance (1) Package θJA θJC (Top of Package) θJ-PAD (Thermal Pad) 128-Lead Exposed Pad 25°C / W 10°C / W 2.8°C / W HLQFP (1) Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.TI.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. 8 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: ADC08500 |
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