Datenblatt-Suchmaschine für elektronische Bauteile |
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ADS8484IBRGZT Datenblatt(PDF) 2 Page - Texas Instruments |
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ADS8484IBRGZT Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 33 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) ADS8484 SLAS511 – NOVEMBER 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) MAXIMUM MAXIMUM NO MISSING CODES TRANSPORT INTEGRAL DIFFERENTIAL PACKAGE PACKAGE TEMPERATURE ORDERING MODEL RESOLUTION MEDIA LINEARITY LINEARITY TYPE DESIGNATOR RANGE INFORMATION (BIT) QTY. (LSB) (LSB) Tape and reel ADS8484IRGZT 250 7x7 48 Pin ADS8484I ±4 –1 to +2 18 RGZ -40 °C to 85°C QFN Tape and reel ADS8484IRGZR 1000 Tape and reel ADS8484IBRGZT 250 7x7 48 Pin ADS8484IB ±2.5 –1 to +1.5 18 RGZ -40 °C to 85°C QFN Tape and reel ADS8484IBRGZR 1000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. over operating free-air temperature range (unless otherwise noted) VALUE UNIT +IN to AGND –0.4 to +VA + 0.1 V –IN to AGND –0.4 to +VA + 0.1 V Voltage +VA to AGND –0.3 to 7 V +VBD to BDGND –0.3 to 7 V +VA to +VBD –0.3 to 2.55 V Digital input voltage to BDGND –0.3 to +VBD + 0.3 V Digital output voltage to BDGND –0.3 to +VBD + 0.3 V TA Operating free-air temperature range –40 to 85 °C Tstg Storage temperature range –65 to 150 °C Junction temperature (TJ max) 150 °C Power dissipation (TJMax – TA)/θJA QFN package θ JA thermal impedance 22 °C/W Vapor phase (60 sec) 215 °C Lead temperature, soldering Infrared (15 sec) 220 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): ADS8484 |
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