Datenblatt-Suchmaschine für elektronische Bauteile |
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74AVCBH164245ZQLR Datenblatt(PDF) 9 Page - Texas Instruments |
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74AVCBH164245ZQLR Datenblatt(HTML) 9 Page - Texas Instruments |
9 / 17 page PACKAGE OPTION ADDENDUM www.ti.com 24-Sep-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 74AVCBH164245GRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AVCBH164245 74AVCBH164245GRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AVCBH164245 74AVCBH164245ZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 WBH4245 SN74AVCBH164245GR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 AVCBH164245 SN74AVCBH164245KR OBSOLETE BGA MICROSTAR JUNIOR GQL 56 TBD Call TI Call TI -40 to 85 WBH4245 SN74AVCBH164245VR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 WBH4245 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. |
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Ähnliche Beschreibung - 74AVCBH164245ZQLR |
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