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DAC088S085 Datenblatt(PDF) 5 Page - Texas Instruments

Teilenummer DAC088S085
Bauteilbeschribung  DAC088S085 8-Bit Micro Power OCTAL Digital-to-Analog Converter With Rail-to-Rail Outputs
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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DAC088S085 Datenblatt(HTML) 5 Page - Texas Instruments

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I/O
GND
TO INTERNAL
CIRCUITRY
5
DAC088S085
www.ti.com
SNAS424D – AUGUST 2007 – REVISED APRIL 2016
Product Folder Links: DAC088S085
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4)
When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin must be limited to 10 mA. The 30-mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10
mA to three.
(5)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax – TA) / RθJA. The values for maximum power dissipation is reached only when the device is operated in a severe fault
condition (for example, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
Such conditions must always be avoided.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage, VA
6.5
V
Voltage on any input pin
–0.3
6.5
V
Input current at any pin(4)
10
mA
Package input current(4)
30
mA
Power Consumption at TA = 25°C
See(5)
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
Machine model (MM)
±250
(1)
All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(2)
The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, does not cause errors in the
conversion result. For example, if VA is 3 V, the digital input pins can be driven with a 5 V logic device.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Operating temperature, TA
–40
125
°C
Supply voltage, VA
2.7
5.5
V
Reference voltage, VREF1,2
0.5
VA
V
Digital input voltage(2)
0
5.5
V
Output load
0
1500
pF
SCLK frequency
40
MHz


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