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CD74HCT574QM96G4Q1 Datenblatt(PDF) 3 Page - Texas Instruments |
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CD74HCT574QM96G4Q1 Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 16 page CD74HCT574Q1 HIGHSPEED CMOS LOGIC OCTAL DTYPE FLIPFLOP 3STATE, POSITIVEEDGE TRIGGERED SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Drain current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V) ±35 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output source or sink current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V) ±25 mA . . . . . . . . . . . . . . . . . Continuous current through VCC or GND, ICC ±50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2): M package 58 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PW package 69 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 300 °C . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages referenced to GND unless otherwise specified. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 V VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V VCC = 2 V 0 1000 tt Input transition (rise and fall) time VCC = 4.5 V 0 500 ns tt Input transition (rise and fall) time VCC = 6 V 0 400 ns TA Operating free-air temperature −40 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. |
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