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CD74HCT574QM96G4Q1 Datenblatt(PDF) 3 Page - Texas Instruments

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Teilenummer CD74HCT574QM96G4Q1
Bauteilbeschribung  HIGH-SPEED CMOS LOGIC OCTAL D-TYPE FLIP-FLOP 3-STATE POSITIVE-EDGE TRIGGERED
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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CD74HCT574Q1
HIGHSPEED CMOS LOGIC OCTAL DTYPE FLIPFLOP
3STATE, POSITIVEEDGE TRIGGERED
SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1)
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Drain current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V)
±35 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output source or sink current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V)
±25 mA
. . . . . . . . . . . . . . . . .
Continuous current through VCC or GND, ICC
±50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 2): M package
58
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
69
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, TJ
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (during soldering):
At distance 1/16
± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max
300
°C
. . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltages referenced to GND unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
MAX
UNIT
VCC
Supply voltage
4.5
5.5
V
VIH
High-level input voltage
VCC = 4.5 V to 5.5 V
2
V
VIL
Low-level input voltage
VCC = 4.5 V to 5.5 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 2 V
0
1000
tt
Input transition (rise and fall) time
VCC = 4.5 V
0
500
ns
tt
Input transition (rise and fall) time
VCC = 6 V
0
400
ns
TA
Operating free-air temperature
−40
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.


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