4

LM2574, LM2574HV

SNVS104D – JUNE 1999 – REVISED APRIL 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Maximum supply voltage

LM2574

4.5

V

LM2574HV

63

ON/OFF pin input voltage

–0.3

V

Output voltage to ground, steady-state

–1

V

Power dissipation

Internally limited

Lead temperature, soldering (10 s)

260

°C

Maximum junction temperature

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

LM2574

40

V

LM2574HV

60

Temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

(3)

Thermal resistances were simulated on a 4-layer, JEDEC board.

6.4 Thermal Information

LM2574, LM2574HV

UNIT

P (PDIP)

NPA (SOIC)

8 PINS

14 PINS

60.4

77.1

°C/W

(3)

59.9

29.2

°C/W

37.9

33.3

°C/W

Junction-to-top characterization parameter

17.1

2

°C/W

Junction-to-board characterization parameter

37.7

32.8

°C/W

(3)

—

—

°C/W