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SM28VLT32SKGD3 Datenblatt(PDF) 7 Page - Texas Instruments

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Teilenummer SM28VLT32SKGD3
Bauteilbeschribung  32-MBIT HIGH-TEMPERATURE FLASH MEMORY WITH SERIAL PERIPHERAL INTERFACE (SPI) BUS
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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SM28VLT32SKGD3 Datenblatt(HTML) 7 Page - Texas Instruments

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SM28VLT32-HT
www.ti.com
SLVSAO2C – NOVEMBER 2012 – REVISED MARCH 2013
Table 2. Bond Pad Coordinates
BOND PAD COORDINATES (µm)
PAD NO.
DESCRIPTION
X MIN
Y MIN
X MAX
Y MAX
1
VCORE
439.985
11182.64
525.035
11267.69
73
VSS
449.715
82.11
534.765
167.16
74
HOLD#
989.765
82.11
1074.815
167.16
75
RST#
1529.815
82.11
1614.865
167.16
76
WP#
2069.865
82.11
2154.915
167.16
77
FLCLK
2609.915
82.11
2694.965
167.16
78
VIO
3149.965
82.11
3235.015
167.16
79
VCORE
3690.015
82.11
3775.065
167.16
145
VSS
3680.285
11182.64
3765.335
11267.69
146
SCK
3144.155
11182.64
3229.205
11267.69
147
SI
2600.185
11182.64
2685.235
11267.69
148
SO
2049.985
11182.64
2135.035
11267.69
149
CS#
1520.085
11182.64
1605.135
11267.69
150
VIO
980.035
11182.64
1065.085
11267.69
Copyright © 2012–2013, Texas Instruments Incorporated
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