LM34926

SNVS847E – JUNE 2012 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

–0.3

100

V

SW to RTN

–1.5

V

SW to RTN (100 ns transient)

–5

V

BST to VCC

100

V

BST to SW

13

V

RON to RTN

–0.3

100

V

VCC to RTN

–0.3

13

V

FB to RTN

–0.3

5

V

200

°C

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The RTN pin is the GND reference electrically connected to the substrate.

(3)

For detailed information on soldering plastic SO PowerPAD package, refer to the Packaging Data Book. Maximum solder time not to

exceed 4 seconds.

(4)

High junction temperatures degrade operating lifetimes. Operating lifetime is derated for junction temperatures greater than 125°C.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

2

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-

750

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Ratings

MIN

MAX

UNIT

7.5

100

V

–40

125

°C

(1)

High junction temperatures degrade operating lifetimes. Operating lifetime is derated for junction temperatures greater than 125°C.

6.4 Thermal Information

LM34926

NGU

DDA

UNIT

8 PINS

Junction-to-ambient thermal resistance

41.3

41.1

Junction-to-case (bottom) thermal resistance

3.2

2.4

Junction-to-board thermal characteristic parameter

19.2

24.4

°C/W

Junction-to-board thermal resistance

19.1

30.6

Junction-to-case (top) thermal resistance

34.7

37.3

Junction-to-top thermal characteristic parameter

0.3

6.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

4

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