Datenblatt-Suchmaschine für elektronische Bauteile |
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TLC251CDG4 Datenblatt(PDF) 3 Page - Texas Instruments |
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TLC251CDG4 Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 22 page TLC251, TLC251A, TLC251B, TLC251Y LinCMOS PROGRAMMABLE LOW-POWER OPERATIONAL AMPLIFIERS SLOS001F – JULY 1983 – REVISED MARCH 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC251Y chip information These chips, properly assembled, display characteristics similar to the TLC251C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJMAX = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – OUT BIAS SELECT IN + IN – OFFSET N1 OFFSET N2 VDD VDD – /GND (7) (6) (8) (3) (2) (1) (5) (4) 48 55 (2) (1) (8) (7) (6) (5) (3) (4) |
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