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UC2827DWTR-1G4 Datenblatt(PDF) 2 Page - Texas Instruments |
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UC2827DWTR-1G4 Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 16 page UC2827-1, UC2827-2 UC3827-1, UC3827-2 SLUS365D – APRIL 1999 – REVISED APRIL 2011 www.ti.com DESCRIPTION (CONTINUED) The UC3827 can be set up in traditional voltage mode control using input voltage feedforward technique or in current mode control. Using current mode control prevents potential core saturation of the push-pull transformer due to mismatches in timing and in component tolerances. With average current mode control, precise control of the inductor current feeding the push-pull stage is possible without the noise sensitivity associated with peak current mode control. The UC3827 average current mode loop can also be connected in parallel with the voltage regulation loop to assist only in fault conditions. Other valuable features of the UC3827 include bidirectional synchronization capability, user programmable overlap time (UC3827-1), user programmable gap time (UC3827-2), a high bandwidth differential current sense amplifier, and soft start circuitry. ORDERING INFORMATION(1) PACKAGES TA = TJ PUSH-PULL TOPOLOGY SOIC-24 PDIP-24 PLCC-28 Current Fed UC2827DW-1 UC2827N-1 - -40 °C to 85°C Voltage Fed UC2827DW-2 UC2827N-2 - Current Fed UC3827DW-1 UC3827N-1 UC3827Q-1 0 °C to 70°C Voltage Fed UC3827DW-2 UC3827N-2 - (1) The DW and Q packages are also available taped and reeled. Add a TR suffix to the device type (i.e., UC2827DWTR-1). THERMAL INFORMATION UC2827-1, UC2827-1, UC2827-2, UC2827-2, UC3827-1, UC3827-1, THERMAL METRIC UNITS UC3827-2 UC3827-2 N J 24 PINS 24 PINS θJA Junction-to-ambient thermal resistance(1) 60 70 to 80 °C/W θJCtop Junction-to-case (top) thermal resistance(2) 30 28 (1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. THERMAL INFORMATION UC2827-1, UC2827-1, UC2827-2, UC2827-2, UC3827-1, UC3827-1, THERMAL METRIC UNITS UC3827-2 UC3827-2 DW (1)QLCC 28 PINS 28 PINS θJA Junction-to-ambient thermal resistance(2) 71 to 83 40 to 65 °C/W θJCtop Junction-to-case (top) thermal resistance(3) 24 30 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 2 Copyright © 1999–2011, Texas Instruments Incorporated |
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