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TPD1E1B04DPYR Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer TPD1E1B04DPYR
Bauteilbeschribung  1-Channel ESD Protection Diode with Low R(DYN) and Low Clamping Voltage
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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TPD1E1B04
SLVSDL0A – MAY 2016 – REVISED JULY 2016
www.ti.com
Product Folder Links: TPD1E1B04
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Electrical fast transient
IEC 61000-4-4 (5/50 ns)
80
A
Peak pulse
IEC 61000-4-5 Power (tp - 8/20 µs)
50
W
IEC 61000-4-5 Current (tp - 8/20 µs)
6.3
A
TA
Operating free-air temperature
–40
125
°C
Tstg
Storage temperature
–65
155
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1500
6.3 ESD Ratings—IEC Specification
VALUE
UNIT
V(ESD)
Electrostatic discharge
IEC 61000-4-2 contact discharge
±30000
V
IEC 61000-4-2 air-gap discharge
±30000
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIO
Input pin voltage
–3.6
3.6
V
TA
Operating free-air temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information
THERMAL METRIC(1)
TPD1E1B04
UNIT
DPY (X1SON)
2 PINS
RθJA
Junction-to-ambient thermal resistance
420
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
169.3
°C/W
RθJB
Junction-to-board thermal resistance
276.1
°C/W
ψJT
Junction-to-top characterization parameter
122.1
°C/W
ψJB
Junction-to-board characterization parameter
157.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W


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