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TMP320C40GDM50C Datenblatt(PDF) 3 Page - Texas Instruments |
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TMP320C40GDM50C Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 15 page TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATINGPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024C − MARCH 1997 − REVISED OCTOBER 2001 3 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 description (continued) The simulation tools include: D Parallel DSP system-level simulation, by Logic Modeling Corporation (LMC), which includes a hardware verification (HV) model and a full functional (FF) model D TI software simulator with high-level language debugger interface for simulating a single processor The hardware development and verification tools include: D Parallel processor in-circuit emulator and high-level language debugger: XDS510 D Parallel processor development system with four TMS320C40s, local and global memory, and communication port connections For additional information when designing for cold temperature operation, please see Texas Instruments application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature number SGUA001. known good die technology Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications. There are currently two verification technologies used at TI to support KGD requirements for the TMP/SMJ320C40KGD: Removable Tab (R-Tab), and Temporary Wire Bond (TWB). The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using modified bonding parameters. This technique allows easy removal of the tape after all needed 100% screens and parametric tests have been performed. The tape is removed from the tested part and the die is shipped in a conventional die container. The gold bumps remain on the bond pads, which allow for subsequent attachment of gold-ball bonds. Similarly, with KGD using the TWB technique, bond wires are attached to the bond pads using adjusted bonding parameters which allow for easy removal of the die after all needed 100% screens and parametric tests have been performed. The die is removed from the temporary package and the die is shipped in a conventional die container. visual inspection of known good die (KGD) using temporary wire bond (TWB) process QML KGD devices produced using the TWB technology do not optically meet MIL-STD-883E (Method 2010, paragraph 3.1.1.1.h) metal bond pad visual inspection criterion due to the bond pad marks formed during bonding removal process. However, these devices have been reliably bonded using normal wire bond precesses, and pass bond strength evaluations. electrical specifications For military electrical and timing specifications, please refer to the SMJ320C40 Digital Signal Processor data sheet, literature number SGUS017. For commercial electrical and timing specifications, see the TMS320C40 Digital Signal Processor Data Sheet, literature number SPRS038. XDS510 is a trademark of Texas Instruments Incorporated. |
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Ähnliche Beschreibung - TMP320C40GDM50C |
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