MC10EPT20, MC100EPT20

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3

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

Power Supply

GND = 0 V

6

V

Input Voltage

GND = 0 V

6

V

Output Current

Continuous

Surge

50

100

mA

TA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

SOIC−8NB

190

130

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

SOIC−8NB

41 to 44

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

TSSOP−8

185

140

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

TSSOP−8

41 to 44

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

DFN−8

129

84

°C/W

Wave Solder (Pb-Free)

<2 to 3 sec @ 260°C

265

°C

Thermal Resistance (Junction-to-Case)

(Note 1)

DFN−8

35 to 40

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)