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MC100LVEL33DG Datenblatt(PDF) 2 Page - ON Semiconductor

Teilenummer MC100LVEL33DG
Bauteilbeschribung  3.3 V ECL /4 Divider
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100LVEL33DG Datenblatt(HTML) 2 Page - ON Semiconductor

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MC100LVEL33
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Figure 1. Logic Diagram and Pinout Assignment
4
3
1
2
5
6
7
8
Q
VEE
VCC
Q
CLK
VBB
R
÷4
Reset
CLK
CLK*, CLK**
ECL Differential Clock Inputs
Q, Q
ECL Differential Data ÷4 Outputs
Reset*
ECL Asynch Reset
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
Table 1. PIN DESCRIPTION
* Pins will default LOW when open due to internal 75 kW
resistor to VEE
** Pins will default to 1/2 VCC when open due to internal
resistors: 75 kW to VEE and 75 kW to VCC
PIN
FUNCTION
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI ≤ VCC
VI ≥ VEE
6 to 0
−6 to 0
V
Iout
Output Current
Continuous
Surge
50
100
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−8 NB
SOIC−8 NB
190
130
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−8 NB
41 to 44 ±5%
°C/W
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
TSSOP−8
41 to 44 ±5%
°C/W
Tsol
Wave Solder (Pb-Free)
< 2 to 3 sec @ 260°C
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.


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