74LVCH245A

Document number: DS35891 Rev. 1 - 2

5 of 10

www.diodes.com

July 2014

© Diodes Incorporated

74LVCH245A

Switching Characteristics

Symbol

Parameter

Test

Conditions

+85°C

+125°C

Unit

Min

Ty

Max

Min

Max

Min

Max

Propagation

Figure 1

1.8V ± 0.15V

1

6.0

12.2

1

12.7

1

16.9

ns

2.5V ± 0.2V

1

3.9

8.1

1

8.5

1

9.1

2.7V

1

4.2

8.7

1

9.6

1

9.9

3.3V ± 0.3V

1.5

3.8

8.1

1.5

8.7

1.5

9.2

Enable Time

or

Figure 1

1.8V ± 0.15V

1

7

14.8

1

15.3

1

22.5

ns

2.5V ± 0.2V

1

4.5

10

1

10.5

1

12.4

2.7V

1

5.4

9.3

1

9.5

1

12.0

3.3V ± 0.3V

1.5

4.4

8.3

1.5

8.5

1.5

11.0

Disable Time

or

Figure 1

1.8V ± 0.15V

1

7.8

16.5

1

17

1

18.4

ns

2.5V ± 0.2V

1

4

9

1

9.5

1

10.5

2.7V

1

4.4

8.3

1

8.5

1

10.0

3.3V ± 0.3V

1.7

4.1

7.3

1.7

7.5

1.7

9.0

Output Skew

Time

3.3V ± 0.3V

—

—

1.0

—

—

—

1.5

ns

Operating Characteristics

Symbol

Parameter

Test Conditions

Typ

Unit

Power dissipation

capacitance per gate

F = 10MHz

Outputs Enabled

1.8V ± 0.15V

9.9

pF

2.5V ± 0.2V

10.2

3.3V ± 0.3V

10.6

Package Characteristics

Symbol

Parameter

Package

Test Conditions

Min

Typ

Max

Unit

Thermal Resistance

Junction-to-Ambient

TSSOP-20

(Note 8)

—

74

—

°C/W

Thermal Resistance

Junction-to-Case

TSSOP-20

(Note 8)

—

15

—

°C/W

Thermal Resistance

Junction-to-Ambient

V-QFN4525-20

(Note 8)

—

67

—

°C/W

Thermal Resistance

Junction-to-Case

V-QFN4525-20

(Note 8)

—

20

—

°C/W

Note:

8. Test conditions for TSSOP-20 and V-QFN4525-20: Devices mounted on 4 layer FR-4 substrate PC board, 2oz copper, with minimum recommended

pad layout per JESD 51-7.