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BD16933EFV-E2 Datenblatt(PDF) 4 Page - Rohm |
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BD16933EFV-E2 Datenblatt(HTML) 4 Page - Rohm |
4 / 25 page 4/21 TSZ02201-0H5H0B301770-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 25.Apr.2016 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD16933EFV-C Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Limit Unit Power Supply Voltage VVS -0.3 to +60 V Driver Supply Voltage VCC -0.3 to +7.0 V Output Voltage VOUT1 to VOUT3 -0.3 to +60 V Output Current (Note 1) IO 1.0 A Logic Input Voltage VSDI, VSCK, VCSB, VEN -0.3 to VCC+0.3 V Logic Output Voltage VSDO -0.3 to VCC+0.3 V SDO Output Current ISDO 5.0 mA Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Junction Temperature Range Tj -40 to +150 °C (Note 1) ASO should not be exceeded Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance (Note 2) Parameter Symbol Thermal Resistance (Typ) Unit 1 layer (Note 4) 4 layer (Note 5) HTSSOP-B20 Junction to Ambient θJA 143.0 26.8 °C/W Junction to Top Characterization Parameter (Note 3) ΨJT 8 4 °C/W (Note 2) Based on JESD51-2A (Still-Air) (Note 3) This thermal characterization parameter reports the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70 μm (Note 5)Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Thermal Via (Note 6 ) Pitch Diameter 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt 1.20mm Φ0.30mm Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2mm x 74.2mm 35 μm 74.2mm x 74.2mm 70 μm (Note 6) This thermal via connects with the copper pattern of all layers. Recommended Operating Conditions (Ta=-40°C to +125°C) Parameter Symbol Min Typ Max Unit Power Supply Voltage (Note 7) VVS 7 12 36 V Logic Supply Voltage (Note 7) VCC 3.0 5 5.5 V Logic Input Voltage (Note 7) VEN, VCSB, VSCK, VSDI -0.3 - VCC V (Note 7) In order to start operation, apply the voltage to VCC (Driver supply voltage) after VS (Power supply voltage) exceeds the minimum operating voltage range (7V). After VCC (Driver supply voltage) exceeds the minimum operating voltage range (3.0V) then apply the voltage to the Logic input pins. |
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