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BD16933EFV-E2 Datenblatt(PDF) 4 Page - Rohm

Teilenummer BD16933EFV-E2
Bauteilbeschribung  Automotive 3ch Half Bridge Driver
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Hersteller  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BD16933EFV-E2 Datenblatt(HTML) 4 Page - Rohm

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TSZ02201-0H5H0B301770-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
25.Apr.2016 Rev.002
www.rohm.com
TSZ22111
• 15 • 001
BD16933EFV-C
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Limit
Unit
Power Supply Voltage
VVS
-0.3 to +60
V
Driver Supply Voltage
VCC
-0.3 to +7.0
V
Output Voltage
VOUT1 to VOUT3
-0.3 to +60
V
Output Current
(Note 1)
IO
1.0
A
Logic Input Voltage
VSDI, VSCK, VCSB, VEN
-0.3 to VCC+0.3
V
Logic Output Voltage
VSDO
-0.3 to VCC+0.3
V
SDO Output Current
ISDO
5.0
mA
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Junction Temperature Range
Tj
-40 to +150
°C
(Note 1) ASO should not be exceeded
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Thermal Resistance
(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1 layer
(Note 4)
4 layer
(Note 5)
HTSSOP-B20
Junction to Ambient
θJA
143.0
26.8
°C/W
Junction to Top Characterization Parameter
(Note 3)
ΨJT
8
4
°C/W
(Note 2) Based on JESD51-2A (Still-Air)
(Note 3) This thermal characterization parameter reports the difference between junction temperature and the temperature at the top center of the outside surface of
the component package.
(Note 4) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70
μm
(Note 5)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Thermal Via
(Note 6 )
Pitch
Diameter
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
1.20mm
Φ0.30mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70
μm
74.2mm x 74.2mm
35
μm
74.2mm x 74.2mm
70
μm
(Note 6) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions (Ta=-40°C to +125°C)
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
(Note 7)
VVS
7
12
36
V
Logic Supply Voltage
(Note 7)
VCC
3.0
5
5.5
V
Logic Input Voltage
(Note 7)
VEN, VCSB, VSCK, VSDI
-0.3
-
VCC
V
(Note 7) In order to start operation, apply the voltage to VCC (Driver supply voltage) after VS (Power supply voltage) exceeds the minimum operating voltage range
(7V). After VCC (Driver supply voltage) exceeds the minimum operating voltage range (3.0V) then apply the voltage to the Logic input pins.


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