IRF6894MTRPbF

3

2016-10-13

Absolute Maximum Ratings

  

 

Symbol

Parameter

Max.

Units

Power Dissipation 

2.8

Power Dissipation 

1.8

W

Power Dissipation 

54

 

Peak Soldering Temperature

270

Operating Junction and

-40 to + 150

°C

Storage Temperature Range

Thermal Resistance

  

 

Symbol

Parameter

Typ.

Max.

Units

Junction-to-Ambient 

–––

45

Junction-to-Ambient 

12.5

–––

Junction-to-Ambient 

20

–––

°C/W

Junction-to-Can 

–––

2.3

Junction-to-PCB Mounted

1.0

–––

Linear Derating Factor 

W/°C

0.022

.

Fig 3.  Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  

Notes:



Surface mounted on 1 in. square Cu board, steady state.





Surface mounted on 1 in. square Cu

board (still air).



Mounted to a PCB with small clip

heatsink (still air)



Used double sided cooling, mounting pad with large heatsink.



Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.





Mounted on minimum footprint full size board with metalized

back and with small clip heatsink (still air)

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

1000

t1 , Rectangular Pulse Duration (sec)

0.0001

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc