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TS80C31X2 Datenblatt(PDF) 11 Page - TEMIC Semiconductors |
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TS80C31X2 Datenblatt(HTML) 11 Page - TEMIC Semiconductors |
11 / 24 page Qualpack TSS463 / TSS461C Rev. 2 – January 1999 11 4.1 Change Procedure All changes are controlled by ECN (Engineering Change Notice). All major changes are notified to those customers using products which are affected by the change. A major change is defined as a change which affects the electrical and/or mechanical specification as defined in the datasheet or which affects the following parameters as defined hereafter: 1 General Major Changes 1-1 Manufacturing line 1-2 Sequence of fabrication process cycle 1-3 Material 1-4 Electrical parameter 1-5 Dimension 1-6 Pad location 1-7 Die size 2 Changes specific to wafer fabrication area 2-1 Doping process 2-2 Gate oxide formation method 2-3 Equipement change 2-4 Layer thickness 2-5 Module dimensions 3 Changes specific to to assembly process area 3-1 Sawing process 3-2 Die attach process 3-3 Wire interconnect method 3-4 Molding process 3-5 Tinning process 4 Changes specific to test area 4-1 Specification limit 4-2 Test coverage reduction 4-3 Product identification 4-4 Final conditioning |
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Ähnliche Beschreibung - TS80C31X2 |
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