Datenblatt-Suchmaschine für elektronische Bauteile |
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AD629 Datenblatt(PDF) 5 Page - Analog Devices |
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AD629 Datenblatt(HTML) 5 Page - Analog Devices |
5 / 20 page AD8270 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage ±18 V Output Short-Circuit Current See derating curve in Figure 2 Input Voltage Range ±VS Storage Temperature Range −65°C to +130°C Specified Temperature Range −40°C to +85°C Package Glass Transition Temperature (TG) 130°C ESD (Human Body Model) 1 kV ESD (Charge Device Model) 1 kV ESD (Machine Model) 0.1 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE Table 5. Thermal Resistance Thermal Pad θJA Unit 16-Lead LFCSP with Thermal Pad Soldered to Board 57 °C/W 16-Lead LFCSP with Thermal Pad Not Soldered to Board 96 °C/W The θJA values in Table 5 assume a 4-layer JEDEC standard board with zero airflow. If the thermal pad is soldered to the board, it is also assumed it is connected to a plane. θJC at the exposed pad is 9.7°C/W. MAXIMUM POWER DISSIPATION The maximum safe power dissipation for the AD8270 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 130°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 130°C for an extended period of time can result in a loss of functionality. The AD8270 has built-in, short-circuit protection that limits the output current to approximately 100 mA (see Figure 19 for more information). While the short-circuit condition itself does not damage the part, the heat generated by the condition can cause the part to exceed its maximum junction temperature, with corresponding negative effects on reliability. 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 –50 –25 0 25 50 75 100 125 AMBIENT TEMPERATURE (°C) PAD SOLDERED θJA = 57°C/W PAD NOT SOLDERED θJA = 96°C/W TJ MAXIMUM = 130°C Figure 2. Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION |
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Ähnliche Beschreibung - AD629 |
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