MC74AC377, MC74ACT377

www.onsemi.com

8

PACKAGE DIMENSIONS

TSSOP−20

DT SUFFIX

CASE 948E−02

ISSUE C

DIM

A

MIN

MAX

MIN

MAX

INCHES

6.60

0.260

MILLIMETERS

B

4.30

4.50

0.169

0.177

C

1.20

0.047

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.65 BSC

0.026 BSC

H

0.27

0.37

0.011

0.015

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.19

0.30

0.007

0.012

K1

0.19

0.25

0.007

0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

_

___

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

110

11

20

PIN 1

IDENT

A

B

−T−

0.100 (0.004)

C

D

G

H

SECTION N−N

K

K1

JJ1

N

N

M

F

−W−

SEATING

PLANE

−V−

−U−

S

U

M

0.10 (0.004)

T

20X

REF

K

L

L/2

2X

S

U

0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40

0.252

---

---

S

U

0.15 (0.006) T

7.06

16X

0.36

16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*