Datenblatt-Suchmaschine für elektronische Bauteile |
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TDH35P3R00JE Datenblatt(PDF) 1 Page - Ohmite Mfg. Co. |
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TDH35P3R00JE Datenblatt(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 38 characteristics tDh series 35 Watt DPAK Package Thick Film Power Surface Mount Terminal Copper Terminal Plating Lead Free Solder (97% Tin, 3% Silver) Resistance Range 0.05Ω to 10KΩ other values on request Tolerance ±1% to ±10% (0.5% on request) Max. Operating Voltage 350V Insulation Resistance 10GΩ min. Power Rating Depends upon case temperature. See der- ating curve. DPAK style power package for surface mounting applications; 35W power rating at 25°C case temperature. Working Temperature Range -55°C to +175°C Solder Process The TDH35P cannot exceed 215°C (260°C for the TDH35H) for more than 10 seconds during soldering process. Derating 100% @ 25°C to 0% @ 150°C curve refer- enced to case temperature Dielectric Strength 1,800VAC Operating Temperature Range -55°C to +150°C Temperature Coefficient 10Ω and above, ±50ppm/°C, referenced to 25°C, ∆R taken at +105°C. Between 1 and 10Ω, ±(100ppm+0.002Ω)/°C, referenced to 25°C, ∆R taken at +105°C. For under 10Ω: 0R6 - 9R9: 100PPM 0R4 - 0R59: 150PPM 0R2 - 0R39: 250PPM 0R1 - 0R19: 500PPM 0R05 - 0R09: 1000PPM Inductance less than 20 nanohenries Flatness less than 0.1mm tolerance Test Condition Result Load Life MIL–R–39009, 2,000 hours ∆R ±(1.0% +0.01Ω) Moisture Resistance MIL–Std–202, Method 106 ∆R =(0.5% +0.01Ω) max. Short Time Overload 2 times rated power with applied voltage not to exceed 1.5 times maximum continu- ous operating voltage for 5 seconds ∆R ±(0.3% +0.01Ω) max. Thermal Shock MIL–Std–202, Method 107, Cond. F ∆R =(0.3% +0.01Ω) max. Terminal Strength MIL–Std–202, Method 211, Cond. A (Pull Test) 2.4N ∆R =(0.2% +0.01Ω) max. Vibration, High Frequency MIL-Std-202, Method 204, Cond. D ΔR =(0.2% +0.01Ω) max. Ohmite’s TDH resistor is an economi- cal solution to intermediate power application design requirements. TDH’s reliable thick film on alumina substrate construction can be easily heat sinked for higher power perfor- mance. TDH resistors are ideal for pulse-loading, pre-charge, bleeder, and snubber applications. Fea tures •35Wattpowerratingat25°C •SMD-DPAKpackageconfigu- ration •Heatresistancetocooling plate:Rth<4.28°C/W •Amoldedcaseforenviron- mental protection. •Resistorelementiselectrically insulated from the metal sink tab. Soldering note: During surface mount soldering the soldering temperature profile must not cause the metal tab of this device to exceed 220°C (260°C for the TDH35H)! Derating 100 Bottom of base plate Temperature, °C 60 20 0 0 50 100 25 75 125 80 40 150 175 35 21 7 0 28 14 Derating(thermalresistance):0.23W/°C(4.28°C/W).The case temperature is to be used for purposes of establishing the applied power limit. The case temperature measurement must be made with a thermocouple contacting the center of the component mounted on the designed heat sink. Thermal grease should be applied propperly. (continued) |
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