MC74VHCT374A

http://onsemi.com

2

Figure 1. Logic Diagram

DATA

INPUTS

D0

D1

D2

D3

D4

D5

D6

D7

18

17

14

13

8

7

4

3

1

OE

19

Q0

Q1

Q2

Q3

Q4

Q5

Q6

Q7

16

15

12

9

6

5

2

NONINVERTING

OUTPUTS

11

CP

Figure 2. Pin Assignment

Q2

D1

D0

Q0

OE

GND

Q3

D3

D2

Q1

5

4

3

2

1

10

9

8

7

6

14

15

16

17

18

19

20

11

12

13

Q6

D6

D7

Q7

CP

Q4

D4

D5

Q5

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

– 0.5 to + 7.0

V

DC Input Voltage

– 0.5 to + 7.0

V

DC Output Voltage

Outputs in 3−State

High or Low State

– 0.5 to + 7.0

V

Input Diode Current

− 20

mA

± 20

mA

DC Output Current, per Pin

± 25

mA

± 75

mA

Power Dissipation in Still Air,

SOIC Package†

TSSOP Package†

500

450

mW

Storage Temperature

– 65 to + 150

_C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any

of these limits are exceeded, device functionality should not be assumed, damage may occur

and reliability may be affected.

†Derating − SOIC Packages: – 7 mW/

_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/

_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage

4.5

5.5

V

DC Input Voltage

0

5.5

V

DC Output Voltage

Outputs in 3−State

High or Low State

0

0

5.5

V

Operating Temperature

− 40

+ 85

_C

Input Rise and Fall Time

0

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

range GND

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.