Datenblatt-Suchmaschine für elektronische Bauteile |
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LM3711XQBP-308 Datenblatt(PDF) 10 Page - National Semiconductor (TI) |
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LM3711XQBP-308 Datenblatt(HTML) 10 Page - National Semiconductor (TI) |
10 / 16 page Circuit Information (Continued) experienced. This light could have an unpredictable affect on the electrical performance of the IC. Care should be taken to shield the device from direct exposure to bright visible or IR light during operation. Micro SMD Mounting The micro SMD package requires specific mounting tech- niques which are detailed in National Semiconductor Appli- cation Note AN-1112. Referring to the section Surface Mount Technology (SMT) Assembly Considerations,it should be noted that the pad style which must be used with the 9-pin package is the NSMD (non-solder mask defined) type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. www.national.com 10 |
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