TDA2EGADQABCRQ1 datasheet(8/393 Pages) TI1

Teilenummer	TDA2EGADQABCRQ1

Bauteilbeschribung	SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0

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SPRS906_BALL_01

8

TDA2EG

SPRS958B – MARCH 2016 – REVISED JANUARY 2017

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Terminal Configuration and Functions

4

Terminal Configuration and Functions

4.1

Terminal Assignment

Figure 4-1 shows the ball locations for the 760 plastic ball grid array (PBGA) package and isused in

conjunction with Table 4-2 through Table 4-31 to locate signal names and ball grid numbers.

Figure 4-1. ABC S-PBGA-N760 Package (Bottom View)

NOTE

The following bottom balls are not pinned out: AF7, AF10, AF13, AF16, AF19, AE4, AE25,

AB26, W3, W26, T3, T26, N3, N26, K3, K26, G3, D4, D25, C10, C13, C16, C19, C22.

These balls do not exist on the package.

NOTE

The following bottom balls are not connected: AH11, AH12, AG2, AG8, AG11, AG12, AF4,

AF6, AF8, AF9, AE3, AE5, AE6, AE8, AE9, AD3, AD8, AD9, Y15, Y16, V18, V19, U18, U19,

U22, U23, U24, U25, U26, U27, U28, T22, T23, T27, T28, R20, R22, R23, R24, R25, R26,

R27, R28, P19, P22, P23, P24, P25, P26, P27, N20, N22, N23, N27, N28, M20, M21, M22,

M23, M24, M25, M26, M27, M28, L20, L21, L22, L23, L24, L25, L26, L27, L28, K20, K21,

K22, K23, K27, K28, J20, J21, J22, J23, J24, J25, J26, J27, H20, H21, H22, H23, H24, H25,

H26, H27, H28, G22, G23, G24, G25, G26, G27, G28, F24, F25, F26, F27, F28, E24, E26,

E27, E28

These balls can be connected as desired, including to VSS. For users designing TDA2x

compatible PCB, please refer to TDA2x Data Manual for appropriate requirements.

4.1.1

Unused Balls Connection Requirements

This section describes the connection requirements of the unused and reserved balls.

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