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TDA2EGAHQABCRQ1 Datenblatt(PDF) 9 Page - Texas Instruments

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Teilenummer TDA2EGAHQABCRQ1
Bauteilbeschribung  SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0
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Hersteller  TI1 [Texas Instruments]
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TDA2EG
www.ti.com
SPRS958B – MARCH 2016 – REVISED JANUARY 2017
Submit Documentation Feedback
Product Folder Links: TDA2EG
Terminal Configuration and Functions
Copyright © 2016–2017, Texas Instruments Incorporated
NOTE
The following balls are reserved: A27, K14, Y5, Y10, B28, AC1, AC2, AA1, AA2, AB1, AB2,
AD14.
These balls must be left unconnected.
NOTE
All unused power supply balls must be supplied with the voltages specified in the
Section 5.4, Recommended Operating Conditions, unless alternative tie-off options are
included in Section 4.4, Signal Descriptions.
Table 4-1. Unused Balls Specific Connection Requirements
Balls
Connection Requirements
AE15, AC15, AE14, D20, AD17, AC16, V27
These balls must be connected to GND through an external pull
resistor if unused.
E20, D21, E23, C20, C21, V28, F18
These balls must be connect to the corresponding power supply
through an external pull resistor if unused.
AF14 (rtc_iso)
This ball should be connected to the corresponding power supply
through an external pull resistor if unused; or can be connected to
F22 (porz) when RTC unused (level translation may be needed)
AB17 (rtc_porz)
This ball should be connected to VSS when RTC is unused; or can
be connected to F22 (porz) when RTC unused (level translation may
be needed)
NOTE
All other unused signal balls with a Pad Configuration register can be left unconnected with
their internal pullup or pulldown resistor enabled.
NOTE
All other unused signal balls without a Pad Configuration register can be left unconnected.
4.2
Ball Characteristics
Table 4-2 describes the terminal characteristics and the signals multiplexed on each ball. The following list
describes the table column headers:
1. BALL NUMBER:This column lists ball numbers on the bottom side associated with each signal on the
bottom.
2. BALL NAME: This column lists mechanical name from package device (name is taken from muxmode
0).
3. SIGNAL NAME:This column lists names of signals multiplexed on each ball (also notice that the name
of the ball is the signal name in muxmode 0).
NOTE
Table 4-2 does not take into account the subsystem multiplexing signals. Subsystem
multiplexing signals are described in Section 4.4, Signal Descriptions.
NOTE
In driver off mode, the buffer is configured in high-impedance.


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