E

D

PIN A1 CORNER

A

A1

D1

e

E1

e

b

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

Ironwood Package code: BGA625C

DIM

Minimum Maximum

A

1.7

A1

0.25

0.40

b

0.40

0.5

D

21.00 BSC

E

21.00 BSC

D1

19.2

E1

19.2

e

0.8 BSC

ARRAY

25 X 25

PIN COUNT

625

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 04/30/2014

Material:

Finish:

Weight:

SM-BGA-9047 Drawing

SCALE: 3:1

SHEET: 3 OF 5

ENG: S. Faiz

FILE: SM-BGA-9047 Dwg

DRAWN BY: M. Raske