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SS-HTD03 Datenblatt(PDF) 1 Page - Laird Tech Smart Technology

Teilenummer SS-HTD03
Bauteilbeschribung  High temperature applications
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Direct Link  http://www.lairdtech.com/
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Tlam
™ SS HTD03
Thermally Conductive PCB Substrate
(High Temperature)
USA: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755 2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com
THR-DS-Tlam-SS HTD03 1115
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies
materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the
Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be
the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Version A01
THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD SUBSTRATE
Tlam SS HTD03 is a high temperature thermally conductive PCB substrate. The construction consists of a
copper circuit layer bonded to an aluminum or copper base plate with 150°C rated Tlam PP HTD03 dielectric.
The technology of Tlam system resides in the Tlam HTD03 dielectric which offers excellent thermal resistance
and high temperature durability.
Tlam SS HTD03 laminate is processed through standard FR4 print and etch operations.
Tlam SS HTD03 has 6~8 times better thermal conductivity than FR4 to keeping components cool. The Tlam SS
HTD03 laminate is processed through standard FR4 print and etch operations and run through standard pick
and place SMT and manual wire bond process.
Standard constructions are made with 1 and 2 ounce copper and 0.040 (1mm) and 0.062 (1.6mm) inch thick
aluminum. Custom construction of heavier weight circuit copper and thicker aluminum and copper base plate
are also available.
FEATURES AND BENEFITS
 Very low thermal resistance of 0.049°C-in²/W
 Cost effective solution which allow simplified
designs and smaller devices
 High temperature applications
 High glass transition temp for lead free solder
compatibility
 UL 746 B RIT of 150℃
 RoHS compliant
 Environmentally green
MARKETS
 Automotive headlamp
 LED applications
 Power supplies – AD/DC and DC/DC
 Motor drives


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