HLMP-NG05 datasheet(10/11 Pages) AVAGO

Teilenummer	HLMP-NG05

Bauteilbeschribung	High brightness light output

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Hersteller	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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Recommended Assembly Condition

• A single-sided phenolic printed circuit board (PCB) is

preferred. Double-sided PCB and other materials may

cause greater lead stress. Recommended through-

hole diameter is 0.98 to 1.08 mm. Leadlength below

the PCB should be 1.5 to 2.0 mm, and the clinching

angle (angle between the lead and PCB) should be 30

±10 degrees.

• If SMT devices and an adhesive are used on the same

pcb as these lamps, the adhesive should be cured

before the lamps are auto-inserted. If curing must

be

done

after

lamp

insertion,

the

cure

temperature and time should not exceed 140°C,

100 seconds. This is the temperature of the surface

normal to the IR source.

TAPE & REEL (for option #002 only)

AMMO PACK (for All options except #002)

Package Options

Lead Option

Ammo Pack

Tape & Reel

(1000 pcs.)

(2000 pcs.)

Straight Lead

#2C —

#002

Formed Lead

#2U —

–

REELING ORIENTATION

CLOCKWISE

ADHESIVE TAPE MUST BE

FACING TOWARDS THE

OUTSIDE OF THE REEL.

ANODE LEAD LEAVES

THE REEL FIRST.

PROTECTIVE

CARDBOARD

110 (4.33) DIA.

336 (13.23) DIA.

DIMENSIONS IN MILLIMETERS (INCHES).

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Purdy Electronics Corpo...	AND720HW	128Kb / 3P	InGaN High Brightness White Light Emission
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Purdy Electronics Corpo...	AND156EYP	25Kb / 2P	InGaAlP High Brightness Yellow Light Emission
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Broadcom Corporation.	ASMT-MX22	1Mb / 14P	Moonstone짰 3W High Brightness Power LED Light Source

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HLMP-NG05 Datenblatt(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED

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