Datenblatt-Suchmaschine für elektronische Bauteile |
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HLMP-LD63 Datenblatt(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-LD63 Datenblatt(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED |
10 / 12 page 0 Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff Ammo Packs Drawing Example of Wave Soldering Temperature Profile for TH LED 0 30 40 90 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting 10 20 60 70 80 50 mechanical force. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. 6.35±1.30 0.25±0.0512 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 20.5±1.00 0.8071±0.0394 12.70±1.00 0.50±0.0394 CATHODE VIEW A - A 0.70±0.20 0.276±0.0079 4.00±0.20 0.1575±0.0079 Ø TYP. |
Ähnliche Teilenummer - HLMP-LD63 |
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Ähnliche Beschreibung - HLMP-LD63 |
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