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74LVC1G11GW Datenblatt(PDF) 2 Page - NXP Semiconductors

Teilenummer 74LVC1G11GW
Bauteilbeschribung  Single 3-input AND gate
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Hersteller  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC1G11GW Datenblatt(HTML) 2 Page - NXP Semiconductors

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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 30 November 2004
2 of 14
Philips Semiconductors
74LVC1G11
Single 3-input AND gate
3.
Quick reference data
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(C
L × VCC
2
× f
o) = sum of the outputs.
[2]
The condition is VI = GND to VCC.
4.
Ordering information
5.
Marking
6.
Functional diagram
Table 1:
Quick reference data
GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPHL, tPLH propagation delay A,
B and C to Y
CL = 50 pF; VCC = 3.3 V
1.0
2.6
4.3
ns
CI
input capacitance
-
4
-
pF
CPD
power dissipation
capacitance
VCC = 3.3 V
[1] [2] -13
-
pF
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G11GW
−40 °C to +125 °C
SC-88
plastic surface mounted package; 6 leads
SOT363
74LVC1G11GV
−40 °C to +125 °C
SC-74
plastic surface mounted package; 6 leads
SOT457
Table 3:
Marking
Type number
Marking code
74LVC1G11GW
VU
74LVC1G11GV
V11
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
001aac033
A
B
C
1
34
Y
6
001aac029
&
4
1
3
6


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