Datenblatt-Suchmaschine für elektronische Bauteile |
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TL-SERIES Datenblatt(PDF) 1 Page - Ohmite Mfg. Co. |
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TL-SERIES Datenblatt(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 158 TL Series Modular Heat Sinkable Thick Film Power Thermal Resistance Ultra* Std** Nominal Surge Load Max. Voltage Ohm Ultra Std. Series Wattage Wattage Power (10 sec.) between terminals Range (10% tol.) (3%-5% tol.) TL54 35 27 18 72 1000 0.3Ω - 1MΩ 1.26 1.67 TL71 96 71 48 192 2000 1.0Ω - 2MΩ 0.53 0.70 TL88 155 114 78 312 2500 1.5Ω - 3MΩ 0.34 0.45 TL104 215 158 108 432 2500 2.0Ω - 4MΩ 0.25 0.33 †TL122 275 202 137 548 2500 2.0Ω - 4MΩ * For properly heat sinked, untrimmed resistors - see chart ** For properly heat sinked, trimmed resistors - see chart † Power Ratings are theoretical. Consult Factory for details. Operating voltage 1200 VAC Dielectric Withstanding Voltage 2500 VAC Resistive Element Thick Film on Alumina Housing Aluminum Insulators Glass reinforced high temperature Valox® Terminals Tinned brass Power Range 27 – 275 watts Resistance Range 0.3Ω – 4MΩ Tolerance Ultra Power (U Style): ±10% std. Standard Power: ±10% std.; 5% and 1% available Temperature Coefficient ±250 PPM Test Voltage for 1 Minute 6000 VDC/2500 VAC Working Voltage 1200 VAC External Creeping Distance 12mm Temperature Limits -40°C to +125°C Insulation >1002 MΩ/500V Air Distance, Terminal to Ground 7mm Inductance 50-100 nH THIS PRODUCT IS DESIGNED FOR USE WITH PROPER HEATSINKING. Maximum base plate temperature of the resistor must be monitored and kept within specified limits to establish the power rating. Best technique is to attach a thermocouple to the side of the base plate of the resistor. Temperature of plastic housing or heat sink cannot be used to establish rating of the resistor. The TL Series add heat sinkable options to the thick film resistor family. The resistor element is packaged with plastic insulators, and quick- connect terminals in a symmetrical aluminum profile for easy heat sink mounting. Special tapped configurations are offered to reduce on board component count. Efficient thermal packaging provides improved heat conduction to the heat sink. Self-insulating package design increases voltage withstanding characteristics when compared to traditional aluminum housings. The in line mounting profile makes the TL Series easily adaptable to most heat sink systems. Thermal compound is always recommended when heat sinking. Fea T ure S • Very low inductance • Low profile design • In-Line Mounting Profile • 1/4” Quick connect ter- minals • Consult factory for common, isolated, or special multiple tap options. S er I e S SP e CIFIC aTIONS aPPLIC a TIONS • Semiconductor Balancing • Frequency Converters • Snubber • In-Rush Current Limiter • Bleeder Resistor • Power Switching • Voltage Dividers C hara CT er ISTICS (continued) |
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