Datenblatt-Suchmaschine für elektronische Bauteile |
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MTB020N06KE3 Datenblatt(PDF) 8 Page - Cystech Electonics Corp. |
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MTB020N06KE3 Datenblatt(HTML) 8 Page - Cystech Electonics Corp. |
8 / 8 page CYStech Electronics Corp. Spec. No. : C103E3 Issued Date : 2017.02.14 Revised Date : 2017.04.05 Page No. : 8/ 8 MTB020N06KE3 CYStek Product Specification TO-220 Dimension *: Typical Millimeters Inches Millimeters Inches DIM Min. Max. Min. Max. DIM Min. Max. Marking: 4 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain 3-Lead TO-220 Plastic Package CYStek Package Code: E3 Device Name Date Code 1 2 3 B020 N06K □□□□ Min. Max. A 4.400 4.600 0.173 0.181 e 2.540* 0.100* A1 2.250 2.550 0.089 0.100 e1 4.980 5.180 0.196 0.204 b 0.710 0.910 0.028 0.036 F 2.650 2.950 0.104 0.116 b1 1.170 1.370 0.046 0.054 H 7.900 8.100 0.311 0.319 c 0.330 0.650 0.013 0.026 h 0.000 0.300 0.000 0.012 c1 1.200 1.400 0.047 0.055 L 12.900 13.400 0.508 0.528 D 9.910 10.250 0.390 0.404 L1 2.850 3.250 0.112 0.128 E 8.950 9.750 0.352 0.384 V 7.500 REF 0.295 REF E1 12.650 12.950 0.498 0.510 Φ 3.400 3.800 0.134 0.150 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. |
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