Datenblatt-Suchmaschine für elektronische Bauteile |
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STGIPL30C60-H Datenblatt(PDF) 7 Page - STMicroelectronics |
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STGIPL30C60-H Datenblatt(HTML) 7 Page - STMicroelectronics |
7 / 24 page DocID024585 Rev 4 7/24 STGIPL30C60-H Electrical ratings 2.2 Thermal data Table 5. Total system Symbol Parameter Value Unit V ISO Isolation withstand voltage applied between each pin and heatsink plate (AC voltage, t = 60sec.) 2500 V T j Power chips operating junction temperature -40 to 150 °C T C Module case operation temperature -40 to 125 °C Table 6. Thermal data Symbol Parameter Value Unit R th(j-c) Thermal resistance junction-case single IGBT 2.2 °C/W Thermal resistance junction-case single diode 5 °C/W |
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Ähnliche Beschreibung - STGIPL30C60-H |
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