Datenblatt-Suchmaschine für elektronische Bauteile |
|
TPA3111D1-Q1 Datenblatt(PDF) 10 Page - Texas Instruments |
|
|
TPA3111D1-Q1 Datenblatt(HTML) 10 Page - Texas Instruments |
10 / 31 page 10 TPA3111D1 SLOS618F – AUGUST 2009 – REVISED JULY 2016 www.ti.com Product Folder Links: TPA3111D1 Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated 7 Detailed Description 7.1 Overview To facilitate system design, the TPA3111D1 requires only a single power supply from 8 V to 26 V for operation. An internal voltage regulator provides suitable voltage levels for the gate driver, digital and low-voltage analog circuitry. Additionally, all circuitry requiring a floating voltage supply, that is, the high-side gate drive, is accommodated by built-in bootstrap circuitry with integrated bootstrap diodes requiring only an external capacitor for each half-bridge. The audio signal path, including the gate drive and output stage is designed as identical, independent full-bridges. Place all decoupling capacitors as close to their associated pins as possible. In general, the physical loop with the power supply pins, decoupling capacitors and GND return path to the device pins must be kept as short as possible and with as little area as possible to minimize induction (see TPA3111D1 Evaluation Module for additional information). For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin (BSx) to the power-stage output pin (OUTx). When the power-stage output is low, the bootstrap capacitor is charged through an internal diode connected between the gate-drive power-supply pin (GVDD) and the bootstrap pins. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM switching frequencies approximately 310 kHz, TI recommends ceramic capacitors with at least 220-nF capacitance, size 0603 or 0805, for the bootstrap supply. These capacitors ensure sufficient energy storage, even during clipped low frequency audio signals, to keep the high-side power stage FET (LDMOS) fully turned on during the remaining part of its ON cycle. Pay special attention to the power-stage power supply; this includes component selection, PCB placement, and routing. For optimal electrical performance, EMI compliance, and system reliability, it is important that each PVCC pin is decoupled with ceramic capacitors placed as close as possible to each supply pin. TI recommends following the PCB layout of the TPA3111D1 EVM. For additional information on recommended power supply and required components, see Application and Implementation and Power Supply Recommendations. The PVCC power supply must have low output impedance and low noise. The power-supply ramp and SD release sequence is not critical for device reliability as facilitated by the internal power-on-reset circuit, but TI recommends releasing SD after the power supply is settled for minimum turnon audible artifacts. |
Ähnliche Teilenummer - TPA3111D1-Q1 |
|
Ähnliche Beschreibung - TPA3111D1-Q1 |
|
|
Link URL |
Privatsphäre und Datenschutz |
ALLDATASHEETDE.COM |
War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |