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TSE2004GB2C0 Datenblatt(PDF) 3 Page - Integrated Device Technology |
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TSE2004GB2C0 Datenblatt(HTML) 3 Page - Integrated Device Technology |
3 / 38 page 3 ©2017 Integrated Device Technology, Inc. May 15, 2017 TSE2004GB2C0 Datasheet Pin Assignments Figure 2. Pin Assignments for 2 x 3 mm 8-TDFN Package – Top View Pin Descriptions Table 1. Pin Descriptions[a] [a] The thermal sensing heat paddle is located at the bottom of the package. JEDEC suggests connecting the heat paddle to ground for better thermal connection between the DIMM PCB plane and the temperature sensor. Number Pin Name Definition 1 SA0 Select Address 0 2 SA1 Select Address 1 3 SA2 Select Address 2 4VSSSPD Ground 5 SDA Serial Data In 6 SCL Serial Clock In 7 EVENT_n Temperature Event Out 8VDDSPD Supply Voltage SDA SCL EVENT_n VDDSPD VSSSPD SA2 SA1 SA0 1 2 3 4 8 7 6 5 |
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