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TSE2004GB2C0 Datenblatt(PDF) 3 Page - Integrated Device Technology

Teilenummer TSE2004GB2C0
Bauteilbeschribung  DDR4 Temperature Sensor with Integrated 4Kbit EEPROM for Memory Module
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Hersteller  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
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©2017 Integrated Device Technology, Inc.
May 15, 2017
TSE2004GB2C0 Datasheet
Pin Assignments
Figure 2. Pin Assignments for 2 x 3 mm 8-TDFN Package – Top View
Pin Descriptions
Table 1. Pin Descriptions[a]
[a] The thermal sensing heat paddle is located at the bottom of the package. JEDEC
suggests connecting the heat paddle to ground for better thermal connection
between the DIMM PCB plane and the temperature sensor.
Number
Pin Name
Definition
1
SA0
Select Address 0
2
SA1
Select Address 1
3
SA2
Select Address 2
4VSSSPD
Ground
5
SDA
Serial Data In
6
SCL
Serial Clock In
7
EVENT_n
Temperature Event Out
8VDDSPD
Supply Voltage
SDA
SCL
EVENT_n
VDDSPD
VSSSPD
SA2
SA1
SA0
1
2
3
4
8
7
6
5


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