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LF298-MIL Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer LF298-MIL
Bauteilbeschribung  Monolithic Sample-and-Hold Circuits
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LF298-MIL Datenblatt(HTML) 4 Page - Texas Instruments

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LF298-MIL
SNOSD57 – JUNE 2017
www.ti.com
Product Folder Links: LF298-MIL
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA, and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX − TA) / RθJA, or the number given in the Absolute
Maximum Ratings, whichever is lower. The maximum junction temperature, TJMAX, for the LF298-MIL is 115°C.
(4)
Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the
supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least
2 V below the positive supply and 3 V above the negative supply.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage
±18
V
Power dissipation
(Package limitation, see (3))
500
mW
Operating ambient temperature
–25
85
°C
Input voltage
±18
V
Logic-to-logic reference differential voltage (see (4))
7
−30
V
Output short circuit duration
Indefinite
Hold capacitor short circuit duration
10
sec
Lead temperature
H package (soldering, 10 sec.)
260
°C
N package (soldering, 10 sec.)
260
°C
M package: vapor phase (60 sec.)
215
°C
Infrared (15 sec.)
220
°C
Storage temperature, Tstg
–65
150
°C
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage
±15
V
TJ
Ambient temperature
–25
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Board mount in 400 LF/min air flow.
6.3 Thermal Information
THERMAL METRIC(1)
LF298-MIL
UNIT
D (SOIC)
LMC (TO-99)
14 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
80.6
85(2)
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
38.1
20
°C/W
RθJB
Junction-to-board thermal resistance
35.4
°C/W
ψJT
Junction-to-top characterization parameter
5.8
°C/W
ψJB
Junction-to-board characterization parameter
35.1
°C/W


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