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LM36011 Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer LM36011
Bauteilbeschribung  Inductorless, Single-LED Flash Driver With 1.5-A High-Side Current Source
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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LM36011
SNVSAN5 – JULY 2017
www.ti.com
Product Folder Links: LM36011
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
IN, OUT, LED
−0.3
6
V
SDA, SCL, STROBE
−0.3
(VIN+ 0.3) w/ 6 V maximum
Continuous power dissipation(3)
Internally limited
Junction temperature, TJ-MAX
150
°C
Storage temperature, Tstg
−65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±250
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN
2.5
5.5
V
Junction temperature, TJ
−40
125
°C
Ambient temperature, TA
(3)
−40
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
LM36011
UNIT
YKB (DSBGA)
8 PINS
RθJA
Junction-to-ambient thermal resistance
117.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.3
°C/W
RθJB
Junction-to-board thermal resistance
34.3
°C/W
ΨJT
Junction-to-top characterization parameter
0.5
°C/W
ΨJB
Junction-to-board characterization parameter
34.6
°C/W


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