Thermal Impedance

Package

Test PCB

Substrate

θ JA (C°/W)

Airflow = 0 m/s

θ JA (C°/W)

Airflow = 1 m/s

θ JA (C°/W)

Airflow = 2 m/s

θ JB (C°/W)

θ JC (C°/W)

165 BGA

4-layer

19.1

15.9

14.9

7.2

2.3

Notes:

1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.

2. Please refer to JEDEC standard JESD51-6.

3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to

the PCB can result in cooling or heating of the RAM depending on PCB temperature.

GS8182D19/37BD-435/400/375/333/300

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Rev: 1.03a 11/2011

11/27

© 2008, GSI Technology

HSTL I/O DC Input Characteristics

Parameter

Symbol

Min

Max

Units

Notes

DC Input Logic High

V

1, 4

DC Input Logic Low

–0.3

V

1, 3

Notes:

1. Compatible with both 1.8 V and 1.5 V I/O drivers

eters.

HSTL I/O AC Input Characteristics

Parameter

Symbol

Min

Max

Units

Notes

AC Input Logic High

—

mV

2, 3

AC Input Logic Low

—

mV

2, 3

—

mV

1

Notes:

3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.