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TDA3MADBABFRQ1 Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer TDA3MADBABFRQ1
Bauteilbeschribung  SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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TDA3MV, TDA3MA
TDA3LX, TDA3LA
SPRS964C – JUNE 2016 – REVISED JULY 2017
www.ti.com
Submit Documentation Feedback
Product Folder Links: TDA3MV TDA3MA TDA3LX TDA3LA
Device Overview
Copyright © 2016–2017, Texas Instruments Incorporated
1.2
Applications
Mono, Stereo or Tri-Optic Front Camera
Object Detection
Pedestrian Detection
Traffic Sign Recognition
Lane Detection and Departure Warning
Automatic Emergency Braking
Adaptive Cruise Control
Forward Collision Warning
High Beam Assist
LVDS or Ethernet Surround View
2D surround view
3D surround view
Rear object detection
Parking assist
Pedestrian Detection
Lane tracking
Drive Recording
Sensor Fusion – Vision, Radar, Ultrasonic, Lidar
sensors
Object data fusion
Raw data fusion
1.3
Description
TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet
the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables
broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller
form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-
free driving experience.
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the
industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar,
and fusion on a single architecture.
The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and
floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac
(EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options
(including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host
of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view
systems, displays, CAN and GigB Ethernet AVB.
The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading
the vision analytics functionality from the application processor while also reducing the power footprint.
The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program
execution and a vector coprocessor for specialized vision processing.
Additionally, Texas Instruments provides a complete set of development tools for the ARM, DSP, and EVE
coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling,
and a debugging interface for visibility into source code execution.
The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
Device Information
PART NUMBER
PACKAGE
BODY SIZE
TDA3x
S-PBGA (367)
15.0 mm × 15.0 mm


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