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SN74AUP1G80YFP Datenblatt(PDF) 1 Page - Texas Instruments

Teilenummer SN74AUP1G80YFP
Bauteilbeschribung  Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74AUP1G80
SCES593F – JULY 2004 – REVISED JULY 2017
SN74AUP1G80 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop
1
1 Features
1
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
Available in the Texas Instruments NanoStar™
Package
Low Static-Power Consumption
(ICC = 0.9 µA Maximum)
Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typical at 3.3 V)
Low Input Capacitance (Ci = 1.5 pF Typical)
Low Noise – Overshoot and Undershoot <10% of
VCC
Ioff Supports Partial-Power-Down Mode Operation
Schmitt-Trigger Action Allows Slow Input
Transition and Better Switching Noise Immunity at
the Input
(Vhys = 250 mV Typical at 3.3 V)
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal
Operation
tpd = 4.4 ns Maximum at 3.3 V
Suitable for Point-to-Point Applications
2 Applications
Home Automation
Factory Automation
Test and Measurement
Enterprise Switching
Telecom Infrastructure
Personal Electronics
White Goods
3 Description
The AUP family is TI's premier solution to the
industry's
low-power
needs
in
battery-powered
portable applications. This family assures a low static-
and dynamic-power consumption across the entire
VCC range of 0.8 V to 3.6 V, resulting in increased
battery life (see AUP – The Lowest-Power Family).
This product also maintains excellent signal integrity
(see Excellent Signal Integrity).
This is a single positive-edge-triggered D-type flip-
flop. When data at the data (D) input meets the setup
time requirement, the data is transferred to the Q
output on the positive-going edge of the clock pulse.
Clock triggering occurs at a voltage level and is not
directly related to the rise time of the clock pulse.
Following the hold-time interval, data at the D input
can be changed without affecting the levels at the
outputs.
NanoStar™
package
technology
is
a
major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs when the device is powered down. This
inhibits current backflow into the device which
prevents damage to the device.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74AUP1G80DBV
SOT-23 (5)
1.60 mm × 2.90 mm
SN74AUP1G80DCK
SC70 (5)
1.25 mm × 2.00 mm
SN74AUP1G80DRY
SON (6)
1.00 mm × 1.45 mm
SN74AUP1G80DSF
SON (6)
1.00 mm × 1.00 mm
SN74AUP1G80YFP
DSBGA (6)
0.76 mm × 1.16 mm
SN74AUP1G80YZP
DSBGA (5)
0.89 mm × 1.39 mm
SN74AUP1G80DPW
X2SON (5)
0.80 mm × 0.80 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)


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