Datenblatt-Suchmaschine für elektronische Bauteile |
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AD7147 Datenblatt(PDF) 40 Page - Analog Devices |
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AD7147 Datenblatt(HTML) 40 Page - Analog Devices |
40 / 71 page Data Sheet AD7147 Rev. E | Page 39 of 70 PCB DESIGN GUIDELINES CAPACITIVE SENSOR BOARD MECHANICAL SPECIFICATIONS Table 19. Parameter Symbol Min Typ Max Unit Distance from Edge of Any Sensor to Edge of Grounded Metal Object D1 0.1 mm Distance Between Sensor Edges1 D2 = D3 = D4 0 mm Distance Between Bottom of Sensor Board and Controller Board or Grounded Metal Casing2 D5 1.0 mm 1 The distance is dependent on the application and the position of the switches relative to each other and with respect to the user’s finger position and handling. Adjacent sensors with no space between them are implemented differentially. 2 The 1.0 mm specification is intended to prevent direct sensor board contact with any conductive material. This specification, however, does not guarantee an absence of EMI coupling from the controller board to the sensors. To avoid potential EMI-coupling issues, place a grounded metal shield between the capacitive sensor board and the main controller board, as shown in Figure 58. SLIDER BUTTONS CAPACITIVE SENSOR PRINTED CIRCUIT D1 D3 D4 8-WAY SWITCH METAL OBJECT D2 Figure 56. Capacitive Sensor Board, Top View D5 CAPACITIVE SENSOR BOARD CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING Figure 57. Capacitive Sensor Board, Side View D5 CAPACITIVE SENSOR BOARD GROUNDED METAL SHIELD CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING Figure 58. Capacitive Sensor Board with Grounded Shield CHIP SCALE PACKAGES The lands on the chip scale package (CP-24-3) are rectangular. The PCB pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. Center the land on the pad to maximize the solder joint size. The bottom of the chip scale package has a central thermal pad. The thermal pad on the printed circuit board should be at least as large as this exposed pad. To avoid shorting, provide a clear- ance of at least 0.25 mm between the thermal pad and the inner edges of the land pattern on the PCB. Thermal vias can be used on the PCB thermal pad to improve the thermal performance of the package. If vias are used, they should be incorporated in the thermal pad at a 1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm, and the via barrel should be plated with 1 oz copper to plug the via. Connect the PCB thermal pad to GND. |
Ähnliche Teilenummer - AD7147_17 |
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Ähnliche Beschreibung - AD7147_17 |
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